This selective wave soldering machine is designed for high-precision PCB assembly where conventional soldering methods may not achieve optimal results. Unlike traditional wave soldering, it delivers solder only to designated areas, avoiding unnecessary heating of the entire board and reducing thermal stress on sensitive components.
The system combines turbulent and laminar solder wave technology, ensuring excellent wetting and reliable solder joints for both through-hole and mixed-technology boards. By focusing solder only where it is needed, it significantly reduces solder consumption and minimizes oxidation during the soldering process.
Durability and stability are achieved through the use of corrosion-resistant materials for the solder pot and high-strength impellers. Multiple nozzle options allow the machine to adapt to different soldering requirements, while the spray fluxing system applies flux evenly for improved joint reliability.
The fixture platform is highly flexible, capable of accommodating different PCB sizes without the need for custom tooling. Programming is simple and intuitive: operators can draw soldering paths directly on the display, and the software automatically simulates and optimizes soldering parameters for efficiency and accuracy.
To further enhance soldering quality, the system can be equipped with nitrogen protection. The controlled atmosphere reduces dross formation, improves solder wetting, and ensures consistent, stable results across a wide variety of applications, all while lowering operational costs.
This selective wave soldering machine is widely used in industries such as automotive electronics, aerospace, communication equipment, LED products, industrial control, and consumer electronics. It is particularly suitable for assemblies that combine surface-mount and through-hole components, or for products containing heat-sensitive devices that require precise and localized soldering.




Maximum Soldering Area | 300 × 250 mm (customizable) |
PCB Thickness | 0.2–6 mm |
PCB Edge Clearance | ≥3 mm |
Control System | PC |
Motion Axes | X, Y, Z |
Motion Control | Servo System |
Positioning Accuracy | ±0.1 mm |
PCB Loading/Unloading | Manual |
Operating Height | 700 ± 30 mm |
Top-side Clearance | Unlimited |
Bottom-side Clearance | 45 mm |
Solder Capacity | 15 kg per pot |
Solder Temperature Control | PID |
Maximum Solder Temperature | 350°C |
Preheating Time | 30–40 minutes |
Solder Pot Power | 1.2 kW |
Waveform Nozzle | Custom Shape |
Nozzle Material | Solder-Resistant Material |
Flux Spraying | Atomizing Valve |
Flux Tank Capacity | 1 L |
Nitrogen Supply Requirement | ≥2 m³/hour |
Nitrogen Purity Requirement | ≥99.998% |
Nitrogen Heating | Standard Equipped |
Nitrogen Consumption | 1–2 m³/hour per pot |
Air Supply Requirement | 0.4-0.6MPa |
Air Flow Requirement | 8–12 L/min |
Total Power | 3 kW |
Operating Power | 1 kW |
Power Supply | AC 220V 50/60Hz (customizable) |
Net Weight | 280 kg |
Machine Dimensions | 1100 × 860 × 1450 mm |
Product Updates: Images and videos displayed may differ from current products due to ongoing design improvements and updates. The actual delivered product shall prevail in case of any discrepancy.
Optional Accessories: Some accessories and components shown in product photos/videos are optional configurations and not included in the standard package. Please order these items separately if required.
Technical Parameters: Specifications are for reference only. Equipment suitability depends on actual working conditions, not just parameter comparison. Please consult us to confirm compatibility for your specific application.