Automatic Wire Stripping and Crimping Machine - KINGSING

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Automatic Selective Wave Soldering Machine

  • Model:KS-S932
  • Net. Weight:
  • Dimension:

This selective wave soldering machine is designed for high-precision PCB assembly where conventional soldering methods may not achieve optimal results. Unlike traditional wave soldering, it delivers solder only to designated areas, avoiding unnecessary heating of the entire board and reducing thermal stress on sensitive components.

The system combines turbulent and laminar solder wave technology, ensuring excellent wetting and reliable solder joints for both through-hole and mixed-technology boards. By focusing solder only where it is needed, it significantly reduces solder consumption and minimizes oxidation during the soldering process.

Durability and stability are achieved through the use of corrosion-resistant materials for the solder pot and high-strength impellers. Multiple nozzle options allow the machine to adapt to different soldering requirements, while the spray fluxing system applies flux evenly for improved joint reliability.

The fixture platform is highly flexible, capable of accommodating different PCB sizes without the need for custom tooling. Programming is simple and intuitive: operators can draw soldering paths directly on the display, and the software automatically simulates and optimizes soldering parameters for efficiency and accuracy.

To further enhance soldering quality, the system can be equipped with nitrogen protection. The controlled atmosphere reduces dross formation, improves solder wetting, and ensures consistent, stable results across a wide variety of applications, all while lowering operational costs.

This selective wave soldering machine is widely used in industries such as automotive electronics, aerospace, communication equipment, LED products, industrial control, and consumer electronics. It is particularly suitable for assemblies that combine surface-mount and through-hole components, or for products containing heat-sensitive devices that require precise and localized soldering.

soldering machine
soldering machine
soldering machine
soldering machine
Maximum Soldering Area300 × 250 mm (customizable)
PCB Thickness0.2–6 mm
PCB Edge Clearance≥3 mm
Control SystemPC
Motion AxesX, Y, Z
Motion ControlServo System
Positioning Accuracy±0.1 mm
PCB Loading/UnloadingManual
Operating Height700 ± 30 mm
Top-side ClearanceUnlimited
Bottom-side Clearance45 mm
Solder Capacity15 kg per pot
Solder Temperature ControlPID
Maximum Solder Temperature350°C
Preheating Time30–40 minutes
Solder Pot Power1.2 kW
Waveform NozzleCustom Shape
Nozzle MaterialSolder-Resistant Material
Flux SprayingAtomizing Valve
Flux Tank Capacity1 L
Nitrogen Supply Requirement≥2 m³/hour
Nitrogen Purity Requirement≥99.998%
Nitrogen HeatingStandard Equipped
Nitrogen Consumption1–2 m³/hour per pot
Air Supply Requirement0.4-0.6MPa
Air Flow Requirement8–12 L/min
Total Power3 kW
Operating Power1 kW
Power SupplyAC 220V 50/60Hz (customizable)
Net Weight280 kg
Machine Dimensions1100 × 860 × 1450 mm
Important Notes:
  1. Product Updates: Images and videos displayed may differ from current products due to ongoing design improvements and updates. The actual delivered product shall prevail in case of any discrepancy.

  2. Optional Accessories: Some accessories and components shown in product photos/videos are optional configurations and not included in the standard package. Please order these items separately if required.

  3. Technical Parameters: Specifications are for reference only. Equipment suitability depends on actual working conditions, not just parameter comparison. Please consult us to confirm compatibility for your specific application.